- Ink formulations.
- Engineering of electronic circuits and high-tech devices.
- Morphological Characterization: FESEM (Field Emission Scanning Electron Miscroscopy) and micro Energy Dispersive X-ray (EDX) analysis of micro-processed surfaces, getting a complete set of information about morphology and surface properties of materials after processing.
- Optical, electrical and magnetic characterization of electronic circuits and high-tech devices.
- Viscosity measurements, surface tension analysis and contact angle measurements.